Wirelessly Supplying Power to Brain

The researchers at Toyohashi University of Technology have developed a technique to implement silicon large-scale integration chips in a very thin film of thickness 10 μm. This fabrication method has the potential to realize a low-invasive flexible device for monitoring brain activity. This study will contribute to the development of brain-machine interface systems.

Full text: Wirelessly Supplying Power to Brain
Toyohashi Tech: Press release